HWA’s Diamond Wires—Precision for the Most Demanding Cuts
- At HWA, our diamond wires are purpose-built to meet the rigorous demands of the silicon, semiconductor, and hard crystal cutting industries.
- Crafted with precision and engineered for performance, our wires deliver:
- Ultra-thin kerf—to reduce material loss and improve yield
- Exceptional dimensional stability—ensuring uniform results every time
- Mirror-like surface finish—ideal for high-grade substrates
- Outstanding durability—minimizing wire breakage and optimizing performance
- With HWA, you get cutting-edge technology designed to elevate your production quality and efficiency.
ThermoTechnologies’ diamond wires meet the growing demands of the silicon, semiconductor, and hard crystal cutting markets.
Specially designed to take on the challenges of cutting the most demanding materials, our diamond wires offer:
- A reduced kerf width to maximize material usage
- Minimal thickness variation for consistent quality
- A flawless surface finish for grade-A substrates
- Enhanced durability to reduce breakage rates and optimize performance