HWA provides innovative fixed abrasive diamond wires meant for slicing silicon and hard crystals. Born from the expertise of Thermocompact in France and Diamond Wire Material Tech Inc. in the US, HWA diamond wires were specifically designed to provide low kerf, low TTV, excellent surface results, high percentages of A grade wafer, and very low breakage ratios.

Continuously seeking for the lowest possible diameters, HWA is currently setting up the production of 50 microns diamond wires.

HWA approach to this market is to provide customer-specific wires optimized for each customer slicing recipe. Our Shanghai-based team has gained experience throughout the years in tuning each of our wires to fit every customer need.

Our manufacturing process was specifically engineered to ensure the highest possible stability. An in-line monitoring system was developed in-house to control and log all manufacturing process parameters. The line control system then reacts to keep all parameters within tight tolerances.

Please submit any specific requirement you may have for diamond wires, and we will be glad to submit our best offer to you.